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The field of integrated circuits and electronic components

Failure analysis of PFA
Decap
Bare Die Extraction
De-layer/De-process
De-Gold Bump

 

Metallographic analysis

Precise fixed point and non fixed point abrasive sample preparation / metallographic section

Microscopic observation and analysis (Lieca DM8000 UV interference 150X, Hitachi S4800 cold field emission electron microscopy + EDS)